Nextreme’s new thermoelectric platform targets optoelectronics

The UPF OptoCooler is well suited for opto-electronics applications. (Photo: Nextreme)

January 24, 2008 — Nextreme Thermal Solutions, which develops microscale thermal and power management products for the electronics industry, has announced a new thermoelectric module.

The company’s Ultra-High Packing Fraction (UPF) OptoCooler addresses the latest cooling and temperature control requirements for optoelectronics, electronics, medical, military and aerospace applications, the company said. It has been optimized for laser diode, LED and advanced sensor products.

The module was developed in response to market demand for microscale cooling solutions that improve the performance of electronics without sacrificing efficiency, the company said.

With Nextreme’s thin-film thermal bump technology at its core, the OptoCooler can be integrated directly into electronic and optoelectronic packaging to deliver more than 45°C of cooling for a wide variety of thermal management applications.


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