Protecting Modern Wafer-level Packages

The demand for smaller sizes and lighter weights in consumer electronic devices is feeding the demand for continued package miniaturization. With expanded systems integrated onto ultra-thin wafers, these exotic final assemblies are extremely delicate. Creating complex nano-devices that function is not enough. They must keep working, and to do that, they need protection.

(January 8, 2008) CARLSBAD, CA — Asymtek and YESTech have developed a process that helps enable medical device manufacturers to meet regulatory requirements for traceability and validation for placement and accuracy when fluid dots are dispensed.


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