January 28, 2008 — Schott, manufacturer and distributor of special glass and glass-related systems, has unveiled its AF 32 glass material, designed for leading-edge opto-electronics applications.
The AF 32 is chemically more stable and possesses a higher temperature resistance than AF 45, the company said in a news release, and has a CTE that matches silicon. This quality, the company said, helps prevent warp during the manufacture of complex assemblies and during reflow, when a WLCSP imager is attached to a printed circuit board.
These properties enable manufacturers to use thinner wafer cover glasses and replace the back glasses on their packages with plastic. In addition, AF 32 glass’ CTE makes it more suitable for use in 12-inch wafer production.