Sigma Designs Places Order for FC-CSP Substrates With Kinsus

Eying huge business potential brought by explosive demand for products based on DVB-T (television) signals, Sigma Designs, already commanding a share of over 70% in the market for chips used in IPTVs (Internet protocol televisions) and set top boxes, has seen its shipment of chips for media processors shoot up quarter by quarter, and thus heavily increased its orders for FC-CSP substrates with its unique Taiwanese supplier of this kind, Kinsus.

(January, 11, 2008) PORTLAND, OR — Electro Scientific Industries Inc. has announced that Winbond Electronics Corp. has adopted ultraviolet (UV) laser link processing to enable its move to 70 nm advanced DRAM production. In addition to purchasing a Model 9850UV dual beam semiconductor link-processing system, Winbond is planning to upgrade several of its existing ESI Model 9830 infrared (IR) laser memory repair tools to UV Model 9835HDE laser systems. ESI shipped the 9850UV system to Winbond in Taichung, Taiwan, in December 2007. Upgrade shipments are expected to commence sometime this year.


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