STATS ChipPAC Ships 25 Millionth Package-in-Package Unit

(January 10, 2008) Singapore — STATS ChipPAC Ltd. has announced it has achieved a milestone of over 25 million units manufactured for its package-in-package (PiP) solutions. PiP is a three dimensional (3D) package technology in which separately assembled and tested packages and bare chips are stacked together in a single chip scale package for exceptional integration flexibility and functional density in a smaller form factor.

(January 11, 2008) TAIPEI — With the increasing popularity of DVB (digital video broadcasting) triggering huge demand for chips, Sigma Designs, the US-based, large-sized supplier of IC (integrated circuit) design, has already placed a sizable order for FC-CSP (flip-chip chip-scale-package) substrates with Taiwan`s Kinsus Interconnect Technology Corp in 2008, according to industry sources, said Taiwan Economic News.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.