TAZMO, Silecs to Co-Market Advanced Materials and Coating Equipment

The co-marketing agreement follows extensive collaboration between both companies on spin-coating and slit-coating process development for IC and LCD applications. In January 2007, TAZMO placed its spin-coating system at Silecs’ electronic materials production and demonstration facilities in Espoo, Finland, to run wafer demos for both companies’ semiconductor customers.

(January 30, 2008) WASHINGTON, DC — “Addressing Cost and Performance-driven Semiconductor Packaging through the Supply Chain.” is the theme of this year’s
Global Business Council of the International Microelectronics And Packaging Society (IMAPS) Spring Meeting, set to take place March 17, 2008 at the Fort McDowell Resort, Scottsdale, AZ. The program will kick-off with a keynote address by Bill Bottoms, CEO, NanoNexus, the title of which is “The 10th Anniversary Edition of the International Technology Roadmap for Semiconductors.”


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