Winbond Selects ESI’s 70 nm Link Processing System for Advanced-DRAM Production

Winbond Memory IC Manufacturing Vice President Wilson Wen explained, “To meet our aggressive product roadmap, we look for the best cost of ownership (CoO) and return on investment across multiple technology nodes. After careful review of the tools available in the industry, without a doubt the ESI 9850UV system provided the highest value proposition with unsurpassed CoO. We also chose to upgrade several of our IR laser systems to UV lasers to meet our 70-nm production requirements.”

(January 7, 2008) MANASSAS, VA — ZESTRON America has announced the addition of Cesar Gazcon as Mexico sales manager. In his role, Gazcon will be responsible for growing ZESTRON’s product and service business while expanding the current customer base in Mexico.


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