Amkor Technology Introduces Novel Package Platform

This leadframe-based, plastic encapsulated package integrates bottom lands within a standard QFP package outline. The novel combination of both peripheral leads and bottom lands allows for an approximate doubling of I/O within a given body size, or a nearly 50% reduction in body size for an existing lead count.

(February 29, 2008) Middlefield, CT — Zygo Corp. has announced that it has acquired the assets of Solvision Inc., a Canadian-based company, including the shares of its Singapore subsidiary. With this acquisition, Zygo enters the market for in-line inspection of flip chip substrates and packaged ICs.

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