Automated Optical Inspection System

This company’s latest M1 AOI system, the M1m, has been developed with special design enhancements to address the advanced inspection challenges presented by complex wire bonding, epoxy splash, and ever-shrinking component sizes. The system offers advanced high-speed device inspection with good defect coverage. With 3 megapixel resolution, telecentric optics, and proprietary Fusion Lighting technology, the M1m inspects bond wires, die placement, and SMT components and substrates, all within a footprint that is <1 sq. m. The system can be put in-line with wire bonders or off-line to support several bonders. With CAD data input, a complete recipe can be completed in <1 hour. The M1m utilizes a standard SMT package library to simplify training and insure program portability across manufacturing lines. This company's off-line programming software allows the engineer to program the system at any remote location while the system continues with production. YESTech, San Clemente, CA;


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