Feb. 8, 2008 – Legacy Holding, a provider of wafer cleaning/strip technologies, says it has submitted a patent application for its proprietary “Organostrip” photoresist removal technology used in backend semiconductor manufacturing processes, saying that opportunities in China’s IC industry make it a sweet spot for business.

The company generally described its technology in a statement, saying it removes photoresist in backend processing “in less than 30 seconds,” claiming it does not damage advanced metal interconnects (e.g. Cu) nor alter electrical properties of low-k dielectric films. It says the technology was developed “through a four year partnership with the world’s largest semiconductor manufacturer” (presumably meaning Intel).

Driving the company’s patent push are increased use of photoresist removal in both backend and solder bump packaging by Asian semiconductor fabs/foundries in Asia, and also growth rates in China, the company noted. It also cited data from the SIA that China’s government seeks to grow its chip industry from $2B in 2000 to $24B by 2010, annual growth of >25%, more than double the projected worldwide annual growth (8%-10%) during the period.

Also noteworthy is the company’s apparent ties to Intel, which has already laid out plans for its proposed 300mm Fab 68 in Dalian, China, expected to open sometime in 2010.

Legacy CEO Robert Matthews stated that following the company’s work with a leading semiconductor equipment manufacturer, it wants to extend the product “to other Tier 1 customers that are experiencing similar challenges,” with the eventual goal of becoming “the technology ‘process of record’ for other Tier 1 fabs.”