Heraeus Opens Upgraded Manufacturing Facility for Assembly Materials

The assembly materials area produces leaded and lead-free versions of solders, solder pastes and fluxes, and conductive and non-conductive adhesives for the assembly of electronic components in the automotive, telecom, semiconductor, aerospace and medical industries. The products from this facility are supplied to electronics manufacturers in North America and are exported to other markets in Europe and Asia.

(February 26, 2008) SAN JOSE, CA &#151 While the book-to-bill ratio has risen steadily to 0.89 since September 2007, when it dipped to .79, billings themselves are still 7% less then December 2007, and 12% less than a year ago, according to the January 2008 Book-to-Bill Report published by SEMI.


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