NEWS ANALYSIS: Toshiba expands MCMs

Feb. 25, 2008 – Toshiba America Electronic Components says it has expanded its family of power multi-chip modules (MCM) with a synchronous step-down converter switching module, targeting applications such as mobile computers, servers, and network equipment.

The TB7005FL, developed by parent group Toshiba, offers output current of 35A and an operating frequency up to 1MHz, making it suitable for high-power CPUs and other point-of-load modules, the company claims. The module combines a new MOSFET gate driver IC for 5V operation with high-side and low-side MOSFETs produced from Toshiba’s UMOS V-H process technology. The low-side MOSFET minimizes on-state resistance (RDS(ON)), gate-to-drain capacitance (Cgd), Cgd/Cgs ratio, and gate resistance (Rg), and the high-side MOSFET is optimized for fast switching, achieved through low gate switch charge (QSW) and gate resistance (Rg).

“At switching frequency of 750kHz, the TB7005FL achieves greater than 90% peak efficiency,” said Jeff Lo, business development manager, power devices, for TAEC. Samples of the 35A Toshiba TB7005FL are available now, with mass production scheduled sometime this quarter (1Q08).


MCMs used to be reserved for high-end applications like mil-aero or microprocessors, where the final ASPs were in the tens to hundreds of dollars. As the world’s No.1 (by revenue) producer of discrete semiconductor chips for the last twenty years, Toshiba saw the opportunity to combine several discretes into a single module to achieve all of the traditional MCM benefits of reduced space and higher performance. With the company’s economies of scale, the final packages can sell for only $3.50 each. Details on the specific packaging technology employed were not available as of press time. — Ed Korczynski, Senior Technical Editor, Solid State Technology


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