SEAJ: Chip tool demand slips in January

Feb. 20, 2008 – New data from SEMI and the Semiconductor Equipment Association of Japan (SEAJ) fuels continued concerns of a soft investment climate among global chipmakers.

Orders for Japan-made semiconductor manufacturing equipment (a three-month moving average) were ¥139.7B (US $) in January, a 4.4% dip from December but down 35% from a year ago. Sales were ¥138.2B ($), up 3% M-M and down ~7% Y-Y.

The book-to-bill ratio (B:B) dropped to 0.91, from 0.99 in December, meaning ¥91 worth of new orders was received for every ¥100 of product billed in the month, remaining below the 1.0 parity mark for the seventh straight month, noted Dow Jones.


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