SEMI publishes standards for FPD, substrate handling, MEMS fluidics

Feb. 12, 2008 – SEMI has published its latest batch of 3x/year new technical standards for semiconductor, flat panel display (FPD), and MEMS manufacturing. This latest batch of eight standards involve testing for leak integrity in gas delivery systems; design/materials guides for interfacing MEMS microfluidic systems; and EHS guidelines for FPD manufacturing.

“These SEMI Standards represent new ground the volunteers in the SEMI International Standards Program have broken over the years, including two new standards applicable to FPD manufacturing,” said Bettina Weiss, SEMI director of International Standards, in a statement.

The list of newly published standards are below — click to SEMI’s Web site for full descriptions:

– SEMI C64: Statistical guidelines for ship-to-control. Provides a consisent, robust statistical methodology for calculating and maintaining ship-to-control limits. Applies to incoming process chemical and material quality elements of the manufacturing process.

– SEMI C65: Guideline for trimethylsilane (3MS), 99.995% quality. Provides appropriate metal and general contamination information about 3MS, used in forming interlayer dielectric (ILD) and diffusion barrier films –e.g., what contaminates and at what level these contaminants are important when setting up the deposition process.

– SEMI C66: Guidelines for trimethylaluminium (TMAl), 99.5% quality. Provides appropriate metal and general contamination information about TMAl, which is used in deposition (MOCVD) of epitaxial films for AlGaAs, AlGaN, and InAlGaP for high-brightness LEDs and lasers, and more recently in ALD of aluminum oxide dielectric in DRAM devices.

– SEMI D51: Specification for handshake method of single substrate for handing off/on tool in FPD production. Aims to standardize the handshake methods for transferring large size single substrates between process equipment and transfer systems at FPD fabs.

– SEMI F106: Test method for determination of leak integrity of gas delivery systems by helium leak detector. Defines two ways to determine leak integrity of conventional metal face sealing and surface mount gas delivery systems. Applies to all types of high-purity gas delivery systems used in semiconductor manufacturing facilities and related R&D.

– SEMI M72 (Preliminary): Test method for determining wafer flatness using the “moving average” qualification metric based on scanning lithography. Quantifies the flatness of 200mm-300mm wafers used in semiconductor device processing (polished, epitaxial, SOI, etc.) with the moving average (MA) as the measurement parameter. Applicable to back and front surface referenced measurements, as well as determining wafer flatness in the near edge region that affects focus control of litho equipment.

– SEMI MS6: Guide for design and materials for interfacing microfluidic systems. Guidelines for general fluidic interface design and materials selection boundary conditions.

– SEMI S26: Environmental/Health/Safety Guideline for FPD manufacturing system. Describes minimum EHS design guidelines and criteria for safety issues for FPD manufacturing. Comparable to SEMI’s S2 document for EHS in semiconductor manufacturing.


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