Solder Die Attach for Power Semiconductor Devices

The Multicore DA100 dispensing grade die attach solder paste dissipates the heat in power semiconductor devices such as rectifiers, power transistors, amplifiers, voltage regulators and other automotive and consumer packages. The paste also provides ease of removal during cleaning processes, low voiding, ease of use, and cost efficiency. Comprised of high lead solder with a liquidus/solidus range of 278°C to 305°C, the paste has been optimized for higher temperature processes, typically those in excess of 350°C. Multicore DA100 has been designed so that the flux residues are easily cleaned with various solvent systems and there are no incompatibility issues between the flux residues and the mold compound. In addition, the paste’s flux system maintains the integrity of the copper leadframe, with no copper degradation or corrosion post-cleaning. Multicore DA100 has also been developed to provide extremely low voids. Henkel’s Electronics Group, Irvine, CA;


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