SPIE NEWS: HamaTech, SEMATECH tout EUV mask blank cleaning work

Feb. 26, 2008 – HamaTech says its advanced modular processing platform, MaskTrack, has achieved “all critical SEMATECH roadmap milestones” for cleaning EUV mask blanks, with demonstrated successful removal of all particles at 30nm and greater, as well as “a number of” 10nm defects, seen as necessary for 22nm semiconductor manufacturing processes.

“The significant contributions made by HamaTech in this first stage of EUV technology development at SEMATECH have helped lay the groundwork for more rapid adoption,” said Ben Eynon, associate director of lithography at SEMATECH, in a statement.

Days ago SEMATECH said it had achieved its EUV blank mask roadmap goals (targeted for the end of 2007), demonstrating defect density of 0.04/sq.cm with a total of 8 defects combined from substrate and multilayer.


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