Feb. 19, 2008 – Sun Microsystems says it has chosen to work with TSMC as its foundry partner for 45nm- and beyond generations of its UltraSPARC CMT processors, following original partner TI’s decision to cease internal leading-edge chip development and outsource the work to foundries.
TI will continue to test and package the 45nm-based processors, the companies noted in a statement. TI VP/GM Hunter Ward added that TI will provide turnkey backend support for SPARC product roadmap.
“TSMC gives us leading process technology coupled with the economics scale of high volume and lower cost,” said David Yen, Sun’s EVP of microelectronics, in a statement.
Jack Sun, VP of R&D at TSMC, called the deal combining the three partners’ efforts “a tremendous synergy of strengths,” combining “all the ingredients to successfully design, test and manufacture” the chips.
Sridhar Vajapey, Sun’s VP of technology, validation and test, added that “TSMC is already fully engaged with engineers from both Sun and TI as we make this transition as seamless and as fast as possible.”