Feb. 29, 2008 – Zygo says it has acquired the assets of Solvision, a Canadian provider of visual inspection equipment, for an undisclosed amount.
The deal, which includes Solvision’s Singapore subsidiary, gives Zygo an entry into in-line inspection of flip-chip substrates and packaged ICs, and Solvision’s Fast Moire Interferometer offers rapid 3D inspection, the company noted in a statement. Jim Northup, president of ZYGO’s metrology solutions division, noted that it is a continuation of a strategy to seek growth in inline process control, and move beyond the wafer.
“Zygo’s strength in high precision metrology, coupled with the high-speed vision capabilities we have just acquired, positions us very well to serve the full semiconductor market,” he stated.
Development of the 3D tool and flip-chip substrate equipment will occur in Montreal, while the IC packaging inspection products will continue to be developed and manufactured in Singapore.