Cost Analysis Tool for 3D IC Manufacturing

This intuitive cost-of-ownership (CoO) tool model is specifically designed to evaluate the cost of a given through-silicon-via (TSV) process flow. It has been developed using Excel so as to be widely exploitable and upgradable. This CoO tool will enable evaluation of the cost/wafer level for manufacturing TSVs using user inputs or pre-defined parameters. This cost analysis tool is dedicated to 3D IC manufacturing for defining and tuning fab parameters such as: number of wafers/year processed, global process yield, number of working days/year, operator cost/year, and engineer cost/year. The tool will provide precise descriptions on cleanroom (CR) class, CR maintenance cost ($/m


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