(March 4, 2008) Dortumund, Germany and Seoul, South Korea ELMOS Semiconductor AG and MagnaChip Semiconductor Ltd. have signed a cooperation agreement regarding the development of automotive semiconductor technologies. In a second step, ELMOS will use the foundry services of MagnaChip for these automotive technologies, with MagnaChip delivering processed wafers to ELMOS.
(March 6, 2008) Radfeld, Austria & Rancho Dominguez, CA Datacon and Ablestik have joined forces to provide joint technological development and shared product evaluations and demonstrations to the marketplace. The aim of this partnership is to strengthen technological leadership, especially in processes such as thin die and/or stacked die handling as well as other advanced epoxy processes, and to advise customers of both companies on the best solutions for their production needs.