Fujitsu Achieves Self-organizing Carbon Nanotube Composite with Graphene

This is cooler than for conventional graphene formed at temperatures too high for electronic device applications, thereby paving the way for the feasible use of graphene as a material suitable for future practical use in electronic devices which are vulnerable to heat.

(March 3, 2008) San Jose, CA — Power Integrations today announced the availability of its TOPSwitch-HX series of AC-DC power conversion ICs in the new eSIP-7C eco-single-inline-package. This package exhibits the low thermal impedance of the traditional TO-220, yet stands less than 10mm above the PCB.


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