Georgia Institute of Technology to Hold Nanopackaging Workshop April 15

Topics to be covered include the long-term strategic needs of the industry and a review of ongoing and proposed new research. Among the topics are: chip-to-package nano-interconnections, nano-coatings, nano-embedded thin-film passive components, and nano-materials for high-performance batteries.

(March 14, 2008) Midland, MI — A U.S.-based personal computer maker has qualified Dow Corning’s TC-5121 thermally conductive compound for use in its manufacturing operations in China. TC-5121, introduced in December, is designed for mid-range electronic systems such as desktop computers and graphic processing units.

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