Line of Assembly Materials
Heraeus Contact Materials Division

This company’s latest versions of its assembly materials will include conductive and nonconductive adhesives for die attach and flip chip applications, heat conductive adhesives for thermal management, and dippable solder pastes for BGA packaging. Given the increasing complexity of BGA packages and the sensitivity of the polymer substrates to multiple thermal processes, the ball dippable (BD) paste series enables manufacturers to utilize SOP substrates while maintaining outstanding yields. Since the convex surface of the SOP substrate causes solder ball movement during reflow when using the traditional flux and drop process, the BD paste allows the balls to be dipped in solder before placement. This prevents ball movement and eliminates the need for printing of solder paste or flux, increasing yields and reducing the need for expensive rework. Other future applications for dippable pastes include package-on-package applications and copper (Cu) stud bumping. Heraeus Contact Materials Division, West Conshohocken, PA;
Booth #457


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