New CSP for Converters Offers Portable Systems Designers Space Savings

“CSP has quickly evolved from an interesting packaging innovation to a mainstream packaging technology,” said Bill Weiss, product line director at AnalogicTech. “By taking advantage of lower component profiles, reduced stray inductance, capacitance and resistance and enhanced electrical characteristics, these new packages will enable designers of cell phones, Bluetooth headsets and other space-constrained portable systems to reduce footprint, improve AC performance, and drive down manufacturing costs.”

(March 12, 2008) Carlsbad, CA — Palomar Technologies, provider of precision automation equipment and process development for microelectronic assembly, will discuss its microelectronic packaging services at the iMAPS International Conference and Exhibition on Device Packaging to be held in Scottsdale, AZ, on March 18 and 19. Palomar Technologies will be exhibiting in booth #66.


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