Power Integrations Introduces eSIP Power Package to Support Low-Profile Trend in Consumer Electronics

This is half the height of the 45-year-old package, and takes less board space. eSIP-based designs reduce the overall height of the power supply in support of increasing market demand for slimmer electronic products such as LCD monitors, flat screen TVs and set-top boxes.

(March 3, 2008) — At SEMICON China 2008, taking place March 18-20 at the Shanghai New International Expo Centre, two of the companies that will showcase new products are FINETECH Shanghai and Kyzen Corp. FINETECH Shanghai will present the FINEPLACER CR7.MD compact rework system at its Booth 2166 and Kyzen will feature its MICRONOX MX2302 engineered semi-aqueous solvent blend at two representatives’ booths: WKK’s Booth 2636 and Sigmatek’s Booth 3725.


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