Kelvin Probe
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The ECT-original Gemini Kelvin probe is a solution that makes reliable, true Kelvin contact for high-volume production test. At 0.15 mm, the ECT Gemini Kelvin probe is said to offer the smallest DUT-side, tip-to-tip spacing seen in high-volume production environments today. It also allows for more manageable board layout with a board-side spacing of 0.45 mm. Gemini Kelvin’s production-ready design reportedly ensures minimal cleaning and reliable contact for hundreds of thousands of device insertions. Everett Charles Technologies, Pomona, CA www.ectinfo.com
Mobile Test Bench
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Delta V Instruments Inc. announces the return of the TSE BOSS test system for burn-in fixtures and high-pin-count contact resistance measurements.Test programming offers text editor, spreadsheet and file converesion tools. Unique pin-to-pin leakage measurement is said to insure 100% test coverage. Multiple force and ground application allows for parallel measurements. Other features include auto-range control and one-time testing for reduced measurement time. Delta V Instruments, Inc. Richardson, TX www.delta-v.com
Thermal Interface Material
As a soft metal alloy thermal interface material (SMA-TIM), Indium’s Heat-Spring offers uniform thermal resistance at lower applied stresses when used in compressed interfaces.
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It features a compressible interface design and is said to provide optimized surface contact, improved thermal conductivity, and enhanced heat flow. It has a bulk thermal conductivity of 86W/mK. Heat-Spring will not bake out or pump out. In addition, it leaves no residue and is reworkable. SMA-TIM products are used for hand placement and are also available in tape & reel packaging for automated placement. Indium Corporation, Utica, NY www.indium.com
RoHS Compliant ZIF Test Sockets
Aries offers four types of universal RoHS-compliant ZIF test sockets: DIP ZIF, PGA ZIF, PLCC ZIF and SOIC ZIF. that accept all package sizes regardless of the row-to-row dimensions and pin counts.
Boasting a life cycle of 25,000 to 50,000 cycles, the DIP ZIF test sockets can be soldered into PCBs or plugged into any socket. Their contacts are normally closed to eliminate dependence on plastic, which helps to sustain contact. Also, the socket handle can be configured with closed contacts when in the up or down position and can be mounted on the right or left side.
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The contacts on PGA ZIF test sockets are activated by a strong metal cam, and the handle can be placed on the left or right side. These sockets plug into standard PGA sockets and have a contact current rating of 1 Amp.
Aries’ Universal PLCC ZIF test socket is sold with “insert plates” that allow the socket to accept PLCC pin counts of 20, 28, 32, 44, 52, 68, and 84. PLCC devices are inserted in the socket “live bug” style (pins down). The socket contains a “bed” of contact pins that are terminated in solder tail pins that mount to the customer’s PCB. This socket has a life cycle of 10,000 insertions.
The Universal SOIC ZIF test socket accepts all gull-wing and J-lead SOIC devices up to 44 pins, has an optional device lifter for easy package removal, and has an operating temperature of 257°F (125°C). Aries Electronics Inc. Bristol, PA www.arieselec.com.
Custom Burn-in Boards
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From schematic capture to parts placement and final routing PPI Time Zero, Inc. designs and manufactures burn-in boards for the semiconductor market. Products include program cards, driver cards, interface boards, fuse cards, demo boards, probe cards and backplanes to meet customer challenges. Processes support polyimide, Getec, FR-40x, BT-Resin, Tin/nickel, full body Gold, and HASL. Sockets include QFN, QFP, SOP, SOT, BGA, uBGA, PGA and PLCC and other specialty sockets. All PPI-Time Zero designers are IPC CID+ Certified and work with Cadence-Allegro Design software using state-of-the art equipment and processes. PPI Time Zero, Inc. Patterson, NJ; www.ppi-timezero.com