SMART Modular Adds Dynamic Burn-In to Its Testing Process and Teams With Aehr Test

(March 26, 2008) Fremont, CA — SMART Modular Technologies Inc. (SMART) has announced it has added test during burn-in (TDBI) to its enterprise class memory (ECM) testing process. SMART’s new TDBI procedure applies functional patterns, temperature, and voltage for screening or eliminating marginal DRAM devices, which can cause time and stress dependent failures. Without this level of burn-in, these flaws could result in early lifetime failures for the memory device.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.