Solder Ball Transfer for Flip Chip and WLCSP

Pushing the limits of each of these technologies has allowed some overlap between these two bumping classifications. But for the most part, volume manufacturing of flip chip bumps and WLCSP bumps are carried out using different processes steps and different types of equipment. One new technology that is showing high promise toward completely bridging this technology gap is solder ball transfer (SBT).

(March 17, 2008) Charlotte, NC & San Jose, CA — The North Carolina Economic Investment Committee has awarded a job development investment grant (JDIG) to Tessera Technologies Inc., a provider of miniaturization technologies for the electronics industry. This grant will support Tessera’s consumer optics plans, enabling the company to add 185 jobs and invest approximately $30 million in its Charlotte-based wafer-level optics facilities during the next five years.


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