Sonoscan Introduces Acoustic Profiling Module

(March 25, 2008) Elk Grove Village, IL — Sonoscan has introduced a new capability for its line of C-SAM acoustic microscopes that reveals the external surface topography of a device at the same time as its internal features. Known as the acoustic surface profile (ASP) module, this important mode can be used to measure warpage of plastic integrated circuits, flip chips, substrates, circuit boards, etc., without any sample preparation.


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