The model DB-6100 stand-alone break processor speeds up sapphire wafer separation. Increasing quantities and continuous price pressure, resulting in cost reduction programs, is driving the die size of photonics components, especially LEDs, further down. Efficient die separation with very small compound semiconductor devices is becoming therefore more of an issue. The advanced design of this break module can break dies as small as 200 x 200µm, even if relatively thick in relation to their size. To extend this capability to laser pre-scribed sapphire wafers of high bright LEDs, the break module has been substantially enhanced in force and cycle time to break the stronger material and to increase the throughput. The new semi-automated breaker model DB-6100 will also be available as a fully automated solution, including cassette-to-cassette wafer handling. DynTest Technologies GmbH, Grassau, Germany; www.dyntest.de.