Thin-film TECs for High-heat Flux Rapid Thermal Response

(March 5, 2008) — In the semiconductor industry, device characterization or screening occurs through the use of two related tests: burn-in and elevated temperature device characterization. with both tests using temperatures in excess of 99°C: the first to accelerate device failure modes that could be related to those failure modes observed in the field and the second to simulate functional device behavior while characterizing the performance level of the device. One significant difference between the two is the cyclic thermal nature of device characterization.

(March 5, 2008) — March is a busy travel month for the Advanced Packaging editors. In the next few weeks, we’ll be reporting from Arizona, where both the BITS Workshop (March 9–12, 2008) and IMAPS’ International Device Packaging Symposium, in conjunction with the Global Business Council (March 17–20, 2008), will be taking place; as well as Shanghai, where Gail Flower, editor-in-chief, will attend SEMICON China (March 18–20, 2008). For those of you who will also be attending these events, here are some highlights focused on advanced packaging technologies and issues.


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