U.S. Computer Maker to Use Dow Corning Compound at China Facility

TC-5121 offers low thermal resistance at 0.1°C-cm2/W and good reliability in an easily screened or stenciled printable material. Designed for mid-range electronic systems such as desktop computers and graphic processing units, it is part of a family of Dow Corning high-performance thermal greases that includes TC-5022 and TC-5026, which offer even higher performance.

By Andrew Strandjord, PacTech USA
(March 19, 2008) — Wafer bumping is often separated into two different categories: flip chip bumping and wafer-level chip scale packaging (WLCSP). This categorization and affiliated nomenclature is mainly based on solder bump size and the type of equipment used to create the bump. “Flip chip” refers to bumps on semiconductor wafers in the range of 50 to 200 µm in height. “WLCSP” refers to bumps that are in the range of 200 to 500 µm in height. Flip Chip bumps are traditionally created by electroplating, evaporation (C4), or paste printing; while WLCSP bumps are produced by dropping preformed solder spheres onto the wafer.


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