(April 23, 2008) Palo Alto, CA&#151 3D packaging is expected to emerge as a dominant performing solution in the electronic/chip packaging industry. Its performance promises to drive efforts across the entire supply chain to successfully deploy it, according to analysis reports from Frost & Sullivan’s Global Trends in Electronic/Chip Packaging. Analysis indicates that the industry is moving beyond system on chip (SoC) to explore various forms of system in package (SiP).