Automatic Multi-chip Bonder

The flexible MCM12 can reportedly handle a range of die sizes and presentation modes. It features a fully programmable dispensing system, and automatic pick-up and ejector tool changing systems. The bondhead achieves up to 800g force and is programmable to automatically change up to 14 different pick up tools. The linear motor driven, gantry-style platform delivers high accuracy and throughput. In flip chip operation, the machine is capable of +/- 10 µm accuracy.

The Pegasus S200A automatic 200mm prober from Wentworth Laboratories, Inc. is the latest addition to the company’s wafer prober line. Intended for high-volume wafer probing of light emitting diodes (LEDs), it also tests discrete devices and wafers up to 200-mm. Pegasus S200A is integrated with production LED testers to bring a fully automatic test platform to the LED production test floor.


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