Datacon Technology Joins EMC-3D Consortium

EMC3D aims to address technical, integration, and economic issues of creating 3-D interconnects using TSV technology for chip stacking and advanced MEMS/sensors packaging. Through collaboration with research partners, the consortium will develop unit processes for creating micro-vias between 5 and 30 &#181m on 50-&#181m thinned 200 and 300-mm wafers using via-first and die-to-wafer techniques. The primary goals of the consortium are reportedly to create a robust integrated process flow at a cost of less than $200 USD per wafer.

(April 10, 2008) Scottsdale, AZ &#151 – MEMS accelerometers have hit the limelight with all the consumer applications in gaming devices, such as the Nintendo Wii, and smart phones like Apple’s iPhone. But these popular products are only the high-profile advance wave of what will be a rising tide of new and innovative uses for the tiny motion sensors, says Douglas McEuen, senior analyst at ABI Research.


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