This workshop will focus on making system level components (chip-to-package interconnections, thin film components conductors, dielectrics, capacitors, resistors, inductors, encapsulants, coatings, power sources, batteries) with nanomaterials enabling a number of commercial applications over the next decade. The workshop will feature keynote speakers from semiconductor companies including Intel and Motorola, followed by technical presentations on these four research topics:

(April 9, 2008) Radfeld, AUSTRIA &#151 EMC^3D, an international semiconductor equipment and materials consortium dedicated to the cost-effective development of 3D through silicon via (TSV) interconnects, announced the addition of Datacon Technology to the organization. Datacon, manufacturer of die bonding & sorting equipment will provide high-precision assembly expertise to the consortium.