NanoDynamics targets printed electronics apps with nano-scale metals

April 9, 2008 — NanoDynamics is targeting the printed electronics industry with a range of metal flakes and powders. “With rapid advancement towards smaller, more complex circuitry, along with a host of innovative printing substrates, the unique properties offered by nano-scale metals including silver, copper and silver-coated copper have become significant to further industry development,” said Dr. Alan Rae, V.P. of Innovations at NanoDynamics.

“Factors including low melting and sintering temperatures that address heat-sensitive applications, and more environmentally responsible and flexible circuit printing methods are ideally addressed through the employment of nanometals,” Rae added.

Among NanoDynamics’ products for this market are ND Silver powders (from 30 nm to 80 nm) and platelets (500 nm), which promise unique stability at elevated temperatures and do not exhibit room temperature sintering and migration.

ND Copper has a crystalline structure that “provides low oxidation and excellent conductivity,” according to NanoDynamics. Powders and flakes are available in sizes from 200 nm to 6 microns. And Silver Coated ND Copper, used extensively in electromagnetic interference (EMI) shielding, conductive adhesives, inks and transparent conductive films, promises high corrosion-resistant surface properties and low-temperature processing capabilities Silver Coated ND Copper materials are available as flakes in 4 to 10 microns.


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