Proactive Thermal Planning

In recent years, long-ignored thermal issues have been wreaking havoc on electronic systems’ reliability. Anyone who has opened a computer case and seen the massive, often elaborate heatsinks attached to microprocessors knows how severe thermal issues can be. And while applying a heatsink is an effective way to cool a microprocessor, a proactive approach, applying various methodologies, is the only solution for successfully designing complex electronic systems to meet thermal requirements.

By Gail Flower, editor-in-chief
On March 18-19 2008, a constant stream of visitors flowed in to SEMICON China, held in the Shanghai New International Expo Centre, to attend grand new product introductions and educational forums that addressed the latest in growth areas for electronics. What a clip of activity surrounded the conference. All of the familiar players were there doing business. For the first time, it seemed that the control rested in the hands of Asians dealing with Asians and other worldwide guests.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.