SEMI has published eight new technical standards applicable to the semiconductor, flat-panel display, and MEMS manufacturing industries. The new standards, developed by technical experts from equipment and materials suppliers, device manufacturers, and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format or can be downloaded from the SEMI web site.
SEMI standards are published three times per year. The new standards, part of the March 2008 publication cycle, join more than 770 standards that have been published by SEMI during the past 34 years.
“These SEMI standards represent new ground the volunteers in the SEMI International Standards Program have broken over the years, including two new standards applicable to FPD manufacturing,” says Bettina Weiss, SEMI director of international standards. “As the FPD industry grows and technical requirements are defined earlier and in concert with suppliers and panel makers, these new specifications provide critical solutions to manufacturing challenges.”
The new standards include a test method for determining the leak integrity of gas delivery systems, a guide for design and materials for interfacing MEMS microfluidic systems, and environmental, health, and safety guidelines for FPD manufacturing.
The full list of SEMI standards recently released includes:
- SEMI C64: SEMI Statistical Guidelines for Ship To Control
- SEMI C65: Guideline for Trimethylsilane (3MS), 99.995% Quality
- SEMI C66: Guidelines for Trimethylaluminium (TMAl), 99.5% Quality
- SEMI D51: Specification for Handshake Method of Single Substrate for Handing Off/On Tool in FPD Production
- SEMI F106: Test Method for Determination of Leak Integrity of Gas Delivery Systems by Helium Leak Detector
- SEMI M72: Test Method for Determining Wafer Flatness Using the Moving Average Qualification Metric Based on Scanning Lithography
- SEMI MS6: Guide for Design and Materials for Interfacing Microfluidic Systems
- SEMI S26: Environmental, Health, and Safety Guideline for FPD Manufacturing System
The SEMI Standards Program, established in 1973, covers all aspects of semiconductor process equipment and materials, from wafer manufacturing to test, assembly, and packaging, in addition to the manufacture of flat-panel displays, photovoltaic systems, and microelectromechanical systems (MEMS). About 1,650 volunteers worldwide participate in the program, which is made up of 18 global technical committees. For more information on these and other standards, visit www.semi.org/standards.