(May 26, 2008) Newburyport, MA — Barry Industries has introduced a line of semiconductor packaging featuring high temperature cofired ceramic (HTCC) technology for aerospace, RF/microwave, semiconductor, and optoelectronic devices.
Barry’s manufacturing facility, Semiconductor Enclosures, is located in Newburyport, MA and manfufactures products such as microwave diodes/varactors, GaAs FETs, MMICs, power smiconductors, RF bpolar transistors, and more.
In addition to the new semiconductor capabilities, Barry also provides a full line of power and precision resistors, terminations and attenuators on Alumina, BeO,
BeO free and aluminum nitride materials for your microwave and RF applications.
Barry also has an LTCC multilayer foundry, design and production facility for products to 65 GHz. High-power ceramic packages, machining, and electroplating complete this vertically integrated company.