Chemical Monitoring and Replenishing Systems

The Qual-Fil QF Series combines ECI Technologies’ chemical monitoring technology with dosing capabilities to address the need for precision metal plating in advanced packaging applications. The modular system supports both electroplating and electroless deposition. It can manage multiple plating baths simultaneously due to online monitoring and automatic replenishment of multiple components. It is suited to TSV, RDL, bumping, SiP, BGA and leadframe applications. ECI Technology Totowa, NJ


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