(May 27, 2008) Lake Buena Vista, FL — The 58th Electronic Components Technology Conference (ECTC), an international conference that brings together the best in packaging, components and microelectronic systems in science, technology and education gets under way Wednesday, May 27, in Lake Buena Vista, FL, with more than 340 technical papers being presented in 36 oral sessions, two poster sessions and a special student poster session. Contributions from more than 20 countries make ECTC a global conference.
Papers will reportedly cover a wide spectrum of topics, including advanced packaging, system packaging, interconnections, electronic components, materials, processing, assembly, manufacturing, optoelectronics, quality, reliability, modeling, and simulation. The technical program includes Emerging Technologies to address recent developments, and this year will offer two sessions focussed on nano-technology, biomedical, and other emerging technologies. The technical program is complemented by three special evening sessions. The plenary session entitled “Product Development in the Semiconductor Industry” chaired by Senol Pekin will give an outlook from industry experts on this important topic.
William Chen chairs the panel discussion on “3D