“Joyce is exceptionally well qualified for this position. He has been a respected, proven leader for us and has the skills and experience to continue building our business and executing on our strategy,” said James Kim, Chairman and Chief Executive Officer of Amkor.
(May 5, 2008) Cham, Switzerland and Singapore — Oerlikon Esec, provider of automated chip assembly equipment and system solutions for the semiconductor industry, formally introduced the introductory platform of an entirely new product family at an official unveiling during SEMICON Singapore. The Die Bonder 2100 xP targets the high-volume epoxy die attach market.