The XF3 lead-free solder paste from Balver Zinn was reportedly developed to accommodate extended reflow profiles without the use of nitrogen. It completes the family of Cobar products based on Nihon Superior’s patented SN100C-alloy.
Kyzen introduces AQUANOX A4241 stencil cleaner, and AQUANOX A4651US for use in ultrasonic immersion cleaners. Both products provide brilliant solder joints with no sump side additives and consistent cleaning results with minimal bath monitoring; are non-hazardous, biodegradable aqueous solution free of CFCs and HAPs; are multi-metal safe; and have been proven compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes.