Multi Flip Chip Bonder for MCM/SiP

This next-generation tool is designed to enable high-volume, high-throughput, high-precision performance for the completion of a multi-chip product in one production
cycle, and reportedly achieves a throughput of up to 10,000 CPH at a precision to 10


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.