Premier Semiconductor Opens Facility in Florida

“Having several facilities situated in strategic geographic locations helps us continue to provide full turn-key solutions for our customers to address their various back-end service needs on a timely basis, wherever they are,”said Dave Loaney, CEO, Premier.

(May 13, 2008) SINGAPORE &#151 STATS ChipPAC Ltd. announced the completion of full internal qualification of its Fan-in Package-on-Package (FiPoP) technology. Fully functional electrical samples are available, and production volumes are expected to ramp by the end of 2008.


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