STATS ChipPAC Completes Qualification of Fan-in PoP

“STATS ChipPAC has internally qualified both top and bottom packages in various body sizes. This qualification opens the door for a multitude of package configurations and provides semiconductor companies a flexible solution to meet their integration and miniaturization demands much sooner and at a lower overall cost,” said Han Byung Joon, Ph.D., Executive VP and CTO, STATS ChipPAC.

(May 14, 2008) Hanoi, VIETNAM &#151 Vietnam-Chipscale Advanced Packaging Services, an an outsource semiconductor assembly and test services (OSATS) provider based in Vietnam, has been presented with its investment certificate from th Vietnamese government, recognizing the company as a 100% foreign owned venture.

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