Entorian Introduces Novel Package-on-Package Technology

(June 14, 2008) AUSTIN, TX &#151 Offered as an alternative to dual-die package stacking, Entorian Technologies, provider of advanced electronic technologies and solutions for enterprise, consumer and other high-growth markets, has introduced RC Stakpak, a low-cost, package-on-package (PoP) stacking technology for DRAM memory.

“We have developed a new innovative stacking solution that leverages our intellectual property,” said Damian Cook, V.P. and general manager of business operations, Entorian. “We believe that our solution is more readily available and lower cost than comparable solutions because RC Stakpak uses standard monolithic memory devices.”

The processes reportedly uses low-cost materials and straightforward manufacturing methodologies to build registered dual inline memory modules (RDIMMs) up to 8-GB in density at speeds of up to DDR2-667.
“Currently we support stacking 512-Mbit and 1-Gbit DDR2 memory devices from multiple suppliers with RC Stakpak” said Timothy Roy, senior director of product Marketing at Entorian. “Smulations have shown the stack itself to be capable of operating at speeds up to DDR2-800 and DDR3-1066.”

Entorian plans to offer qualification samples to its customers in July, with full production following in September.


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