Macro-inspection Software Option

Systems combining multiple inspection tasks in one tool such as frontside, backside and edge inspection traditionally can run only one wafer lot at a time. With Vistec’s software package option, Parallel Job Control for LDS3300 C, it is possible to run multiple control jobs at the same time, rather than have single modules sitting idle without measuring a wafer, while other modules are continuously scanning wafers.

Parallel Job Control allows for higher utilization of LDS3300 C’s integrated inspection modules. A shorter cycle is said to be achieved in addition to lower cost-of-ownership. In addition to the software package option, The LDS3300 C features automatic macro inspection combined with an optical microscope, and flexibility in setup with different modules for wafer frontside , edge-, backside, and microscopic wafer inspection. Vistec Semiconductor Systems, GmbH Weilburg, Germany, www.vistec-semi.com

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.