June 18, 2008 — NEXX Systems, a provider of process equipment for advanced wafer-level packaging applications, will participate in IMEC’s Industrial Affiliation Program (IIAP) on 3D integration. IMEC is an independent non-profit research center in nanoelectronics and nanotechnology focusing on the next generations of chips and systems, and on the enabling technologies for ambient intelligence.
As a member of this program, NEXX Systems will install a Stratus S300-FX electrodeposition system at IMEC’s facility in Leuven, Belgium for joint research and development of the metallization of through silicon vias (TSVs) and micro-bumping. The TSVs and micro-bumps are fabricated with electrodeposition technology and play a key role in 3D integration.
“We are delighted to continue our partnership with NEXX Systems and are confident that the Stratus will give our partners leading-edge electrodeposition technology for 3D integration,” says Eric Beyne, program director of the Advanced Packaging and Interconnect Center at IMEC.
“3D integration is an exciting new technology that addresses the ever-increasing demands for smaller, more complex, electronic devices,” says Richard Post, NEXX’s CEO. “Our partnership with IMEC will enhance continuing efforts to develop robust, low cost electroplating solutions that will enable future products for consumer electronics as well as automotive, medical, and office networking applications.”